Research on pyrex 7740 glass deep etching mask

WANG Wei-kang; YUAN Wei-zheng; REN Sen; DENG Jin-jun; SUN Xiao-dong

doi:10.13873/j.1000-97872014.06.015

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Research on pyrex 7740 glass deep etching mask

更新时间：2025-09-11

- Research on pyrex 7740 glass deep etching mask
- Vol. 33, Issue 6, Pages: 15-18(2014)
- 作者机构：
  
  西北工业大学空天微纳系统教育部重点实验室
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872014.06.015
  CLC： TN305.7
- Published：2014
- 稿件说明：
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[1]王伟康,苑伟政,任森,邓进军,孙小东.Pyrex 7740玻璃深刻蚀掩模研究[J].传感器与微系统,2014,33(06):15-18.

WANG Wei-kang, YUAN Wei-zheng, REN Sen, et al. Research on pyrex 7740 glass deep etching mask[J]. 2014, 33(6): 15-18.
[1]王伟康,苑伟政,任森,邓进军,孙小东.Pyrex 7740玻璃深刻蚀掩模研究[J].传感器与微系统,2014,33(06):15-18. DOI： 10.13873/j.1000-97872014.06.015.

WANG Wei-kang, YUAN Wei-zheng, REN Sen, et al. Research on pyrex 7740 glass deep etching mask[J]. 2014, 33(6): 15-18. DOI： 10.13873/j.1000-97872014.06.015.

摘要

玻璃湿法深刻蚀掩模常采用低压化学气相沉积（LPCVD）多晶硅、Cr/Au金属层+光刻胶等

但往往会在玻璃中引入应力

影响后期应用（如阳极键合）

而且Cr/Au金属层价格昂贵。为避免以上缺点

引入了SX AR—PC 5000/40保护胶+WBR2075干膜作为玻璃的刻蚀掩模

在HF︰NH4F

HF︰HCl

HF︰HCl︰NH4F刻蚀溶液中进行了大量实验。实验结果表明:SX AR—PC 5000/40抗腐蚀能力强

且成功实现了对Pyrex 7740玻璃131μm的深刻蚀。整个工艺过程与IC工艺兼容

可以进行圆片级批量加工。实验结果对圆片级封装和其他MEMS器件的制作有一定参考作用。

Abstract

Glass wet deep etching mask often uses LPCVD poly-silicon or Cr /Au metal layer combined with photoresist

which will induce stress in glass and affect the late application such as anodic bonding. Besides

Cr / Au is expensive. In order to avoid above shortcomings

protective coating SX AR—PC 5000 /40 combined with WBR2075 dry film is introduced as a new etching mask. Lots of experiments are investigated in HF︰NH4F

HF︰ HCl

HF︰HCl︰NH4F etching solution. It is shown by the experiments that SX AR—PC 5000 /40 has strong resistance to corrosion

and deep etching on pyrex 7740 glass of depth of 131 μm is obtained. The whole process is compatible with standard IC process and can be batch fabricated at wafer-level. Experimental result has reference function for fabrication of some MEMS device

and wafer-level package.

关键词

Keywords

references

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Pyrex玻璃的湿法深刻蚀及表面布线工艺 [J]. 许晓昕,高翔,徐静,吴亚明. 功能材料与器件学报 . 2007(06)

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毛细管电泳芯片的制造 [J]. 汤扬华,周兆英,叶雄英,冯焱颖,金亚. 微细加工技术 . 2001(01)

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A new fabrication method for borosilicate glass capillary tubes with lateral inlets and outlets [J] . M.-A Grétillat,F Paoletti,P Thiébaud,S Roth,M Koudelka-Hep,N.F de Rooij. Sensors & Actuators: A. Physical . 1997 (1)

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