Study on residual stress in anodic bonding of multi-ranged accelerometer

BAO Ai-da; XU Xiang-ju; GONG Shan

doi:10.13873/j.1000-97872013.03.007

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Study on residual stress in anodic bonding of multi-ranged accelerometer

更新时间：2025-09-11

- Study on residual stress in anodic bonding of multi-ranged accelerometer
- Vol. 32, Issue 3, Pages: 15-16(2013)
- 作者机构：
  
  中北大学仪器科学与动态测试教育部重点实验室电子测试技术重点实验室
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872013.03.007
  CLC： TH824.4
- Published：2013
- 稿件说明：
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[1]鲍爱达,徐香菊,龚珊.复合量程加速度计阳极键合残余应力研究[J].传感器与微系统,2013,32(03):15-16.

BAO Ai-da, XU Xiang-ju, GONG Shan. Study on residual stress in anodic bonding of multi-ranged accelerometer[J]. 2013, 32(3): 15-16.
[1]鲍爱达,徐香菊,龚珊.复合量程加速度计阳极键合残余应力研究[J].传感器与微系统,2013,32(03):15-16. DOI： 10.13873/j.1000-97872013.03.007.

BAO Ai-da, XU Xiang-ju, GONG Shan. Study on residual stress in anodic bonding of multi-ranged accelerometer[J]. 2013, 32(3): 15-16. DOI： 10.13873/j.1000-97872013.03.007.

摘要

复合量程加速度计阳极键合过程中产生的残余热应力会引起加速度计的零位失调

也是导致加速度计失效的原因之一。对键合过程中产生的残余热应力进行了研究

仿真并分析了残余热应力与键合温度、玻璃基底厚度和框架键合宽度的影响

确定了适合复合量程加速度计的最佳键合宽度和玻璃基底厚度。

Abstract

The residual thermal stress in anodic bonding of multi-ranged accelerometer can cause zero imbalance of the accelerometer

but also one of the factors that lead to the failure of the accelerometer.Residual thermal stress generated in the process of anodic bonding is studied

and at the same time

the effect of residual stress and bonding temperature

the thickness of the glass substrate and the frame bonding width are simulated and analyzed

the best width of frame and thickness of the glass substrate are determined.

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references

MEMS封装中阳极键合技术的影响因素研究和设计因素分析 [J]. 赵翔,梁明富. 新技术新工艺 . 2009(12)

硅玻璃阳极键合绝压压阻式压力传感器中的残余应力 [J]. 许东华,张兆华,林惠旺,刘理天,任天令. 功能材料与器件学报 . 2008(02)

用有限元方法分析Si/GaAs的键合热应力（英文） [J]. 何国荣,杨国华,郑婉华,吴旭明,王小东,曹玉莲,王青,陈良惠. 半导体学报 . 2006(11)

Ⅲ-Ⅴ族半导体晶片键合热应力分析 [J]. 陈斌,王兴妍,黄辉,黄永清,任晓敏. 半导体光电 . 2005(05)

MEMS封装技术及标准工艺研究 [J]. 关荣锋,汪学方,甘志银,王志勇,刘胜,张鸿海,黄德修. 半导体技术 . 2005(01)

MEMS加速度计温度场及残余应力模型研究 [D]. 游侠飞. 浙江大学 2012

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