Design and preparation of micro-valve driven bythermal expansion

WU Yuan-qing; YAO Su-ying

doi:10.13873/j.1000-97872012.10.043

Chinese

您当前的位置：

首页 >

文章列表页 >

Design and preparation of micro-valve driven bythermal expansion

更新时间：2025-09-11

- Design and preparation of micro-valve driven bythermal expansion
- Vol. 31, Issue 10, Pages: 100-102(2012)
- 作者机构：
  
  天津大学电子信息工程学院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872012.10.043
  CLC： TP211.4
- Published：2012
- 稿件说明：
移动端阅览
[1]吴元庆,姚素英.热膨胀驱动型微阀的设计与制备[J].传感器与微系统,2012,31(10):100-102.

WU Yuan-qing, YAO Su-ying. Design and preparation of micro-valve driven bythermal expansion[J]. 2012, 31(10): 100-102.
[1]吴元庆,姚素英.热膨胀驱动型微阀的设计与制备[J].传感器与微系统,2012,31(10):100-102. DOI： 10.13873/j.1000-97872012.10.043.

WU Yuan-qing, YAO Su-ying. Design and preparation of micro-valve driven bythermal expansion[J]. 2012, 31(10): 100-102. DOI： 10.13873/j.1000-97872012.10.043.

摘要

利用IntelliSuite软件对热膨胀驱动微阀进行结构分析设计

讨论了微加热器结构等因素对于微阀的影响。利用SU—8胶成型工艺制备了聚二甲基硅氧烷（PDMS）微阀所需要的模具。热膨胀驱动微阀的制备过程分为:薄膜微加热器的金属淀积、阀腔的制备、弹性薄膜的制备和流体通道的制备四部分

详细阐述了各部分的制备工艺流程和各层之间的改性键合工艺等。通过微加工工艺提高了微阀的性能。利用蠕动泵作为流体驱动源

对微阀的性能进行验证

当阀腔驱动电压达到9 V时

实现了微阀关闭。

Abstract

Structure analysis and design on thermal expansion driven micro-valve is carried out

using IntelliSuite software

and effect of factors

such as structure of micro-heater

which influences micro-valve is discussed.The model for PDMS micro-valve is made using SU—8 glue moulding process.The whole process of micro-valve preparation is divided into four parts as metal deposit of thin-film micro-heater

preparation of micro-valve elastic thin film and fluid flow passage

and fabrication process of every part and the bonding technique are stated.The property of micro-valve is improved by microprocessing.Pump is used as driving source of fluid

when the driving voltage of micro-valve reach up to 9V

the micro-valve is closed successfully.

关键词

Keywords

references

微流体系统中微阀的研究现状 [J]. 肖丽君,陈翔,汪鹏,李以贵,陈迪. 微纳电子技术 . 2009(02)

液相芯片技术的原理与应用进展 [J]. 陈玮. 成都医学院学报 . 2008(03)

Views

179

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Reliability simulation analysis of multilayer chip bonding interface

Design of a high precision capacitive MEMS accelerometer system

Research on BCB bonding process of acceleration sensitive chip made of three-layer Si wafer

Design and fabrication of a low-noise MEMS accelerometer

Mechanical simulation analysis on Si substrate bonding GaAs film

Related Author

YANG Fashun

YANG Xunyong

WANG Yongyong

HAN Zhikang

XIONG Xing-yin

LI Zong-wei

YANG Yan

CONG Ning

Related Institution

College of Big Data and Information Engineering,Guizhou University

University of Chinese Academy of Sciences

Key Laboratory of Petroleum Resources Research,Institute of Geology and Geophysics,Chinese Academy of Sciences

The 49th Research Institute,China Electronics Technology Group Corporation

Key Laboratory of Micro and Nano Systems for Aerospace of Ministry of Education,Northwestern Polytechnical University

⁰