Research on wafer-lever vacuum package by glass frit at low temperature

WANG Wei1; XIONG Bin1; WANG Yue-lin1; MA Ying-lei1

doi:10.13873/j.1000-97872012.01.029

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Research on wafer-lever vacuum package by glass frit at low temperature

更新时间：2025-09-11

- Research on wafer-lever vacuum package by glass frit at low temperature
- Vol. 31, Issue 1, Pages: 62-64(2012)
- 作者机构：
  
  1. 中国科学院上海微系统与信息技术研究所
  2. 中国科学院研究生院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872012.01.029
  CLC： TP211.4
- Published：2012
- 稿件说明：
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[1]王伟,熊斌,王跃林,马颖蕾.低温玻璃浆料圆片级真空封装的研究[J].传感器与微系统,2012,31(01):62-64.

WANG Wei1, XIONG Bin1, WANG Yue-lin1, et al. Research on wafer-lever vacuum package by glass frit at low temperature[J]. 2012, 31(1): 62-64.
[1]王伟,熊斌,王跃林,马颖蕾.低温玻璃浆料圆片级真空封装的研究[J].传感器与微系统,2012,31(01):62-64. DOI： 10.13873/j.1000-97872012.01.029.

WANG Wei1, XIONG Bin1, WANG Yue-lin1, et al. Research on wafer-lever vacuum package by glass frit at low temperature[J]. 2012, 31(1): 62-64. DOI： 10.13873/j.1000-97872012.01.029.

摘要

研究了玻璃浆料在低温下真空封装MEMS器件的工艺。封装过程中

采用了丝网印刷技术

丝网的线宽设计为100μm

印刷后玻璃浆料线宽为160μm左右

从而能够减小封装器件的尺寸

节省成本;另外

对玻璃浆料键合工艺做了研究

找到了较好的工艺条件

采用该工艺（预烧结温度425℃

键合温度430℃）

得到的封装结构具有较高的封接强度（剪切力>20 kgf）和良好的真空度

测得的漏率为10-9 cm3/s。

Abstract

Glass frit packaging is important for MEMS devices vacuum packaging.Screen printing is applied in package

and the width of screen is designed as 100 μm to reduce the manufacturing costs.Detail process characterization of glass frit bonding are also discussed.The packaging structure has high bonding strength（shear is more than 20 kgf）and leakage rate is 10-9cm3/s.

关键词

Keywords

references

采用精密印刷技术的玻璃浆料圆片级气密封装 [J]. 陈骁,罗乐. 功能材料与器件学报 . 2010(03)

Wafer level packaging of MEMS [J] . Masayoshi Esashi. Journal of Micromechanics and Microengineering . 2008 (7)

Wafer level encapsulation of microsystems using glass frit bonding [J] . Microsystem Technologies . 2006 (5)

Glass frit bonding: an universal technology for wafer level encapsulation and packaging [J] . Roy Knechtel. Microsystem Technologies . 2005 (1)

Low-Cost Wafer-Level Vacuum Packaging for MEMS [J] . Roland Gooch,Thomas Schimert. MRS Bulletin . 2003 (1)

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