Design and simulation of an inductive heater for micronozzle

CHANG Wen-bo; LI De-sheng; LIU Ben-dong

doi:10.13873/j.1000-97872011.12.040

Chinese

您当前的位置：

首页 >

文章列表页 >

Design and simulation of an inductive heater for micronozzle

更新时间：2025-09-11

- Design and simulation of an inductive heater for micronozzle
- Vol. 30, Issue 12, Pages: 109-111+118(2011)
- 作者机构：
  
  北京工业大学机电学院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872011.12.040
  CLC： TP211.4
- Published：2011
- 稿件说明：
移动端阅览
[1]常文博,李德胜,刘本东.一种用于微喷的感应加热器设计与仿真[J].传感器与微系统,2011,30(12):109-111+118.

CHANG Wen-bo, LI De-sheng, LIU Ben-dong. Design and simulation of an inductive heater for micronozzle[J]. 2011, 30(12): 109-111+118.
[1]常文博,李德胜,刘本东.一种用于微喷的感应加热器设计与仿真[J].传感器与微系统,2011,30(12):109-111+118. DOI： 10.13873/j.1000-97872011.12.040.

CHANG Wen-bo, LI De-sheng, LIU Ben-dong. Design and simulation of an inductive heater for micronozzle[J]. 2011, 30(12): 109-111+118. DOI： 10.13873/j.1000-97872011.12.040.

摘要

提出了一种用于热微喷头的感应加热器新结构。进行了相关的结构和工艺设计

在MEMS工艺环境下制作出了可以非接触加热

工艺结构简单

使用寿命长的微感应加热器。使用ANSYS对微感应加热器进行了建模和仿真分析

结果显示:感应加热器的最大加热功率可达到5 mW以上

满足设计要求

同时得到了感应加热器的功率影响因素。

Abstract

A new structure of micro inductive heater for micronozzle is proposed.The inductive heater has some advantages such as non-contact heating

simple process and long lifetime.The prototype of the heater is designed by theoretical calculation and fabricated in MEMS laboratory.The heating power is calculated and analyzed by ANSYS.It shows that the power of the inductive heater could exceed 5 mw.The result meets the design requirements.

关键词

Keywords

references

电磁感应加热技术在注射机温度控制系统上的应用 [J]. 常士家,何雪涛,谢鹏程,杨卫民. 塑料科技 . 2009(05)

具有斜拉梁的串联接触式射频微机电系统开关 [J]. 侯智昊,刘泽文,胡光伟,刘理天,李志坚. 清华大学学报(自然科学版) . 2009(02)

高频电磁感应加热技术在接装纸鼓轮中的应用 [J]. 段绍伟,黄兰英. 烟草科技 . 2006(02)

打印机传感器常见故障检修 [J]. 梁宏斌. 设备管理与维修 . 2005(09)

感应加热线圈中的电磁场 [J]. 肖新棉. 武汉水利电力大学学报 . 1996(06)

热泡式喷墨的建模与分析 [D]. 彭飞. 西安电子科技大学 2007

High-aspect-ratio silica nozzle fabrication for nano-emitter electrospray applications [J] . Ling Wang,Robert Stevens,Adnan Malik,Peter Rockett,Mark Paine,Paul Adkin,Scott Martyn,Katherine Smith,John Stark,Peter Dobson. Microelectronic Engineering . 2007 (5)

Investigation to minimize heater burnout in thermal thin film print heads [J] . J.-H. Park,Y.S. Oh. Microsystem Technologies . 2005 (1)

Views

125

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Research on corona discharge based on AFM probe

Research on novel MEMS shock accelerometer

Proving ground road identification system based on MEMS sensor

Simulation and experiment of trapezoidal beam vibration energy harvester

Design and test of capacitive micro ultrasonic transducer based on wafer to wafer bonding

Related Author

ZHAO Gui1

KONG De-yi1

Juergen Brugger3

CHEN Chi-lai1

CHENG Yu-peng1

LI Zhuang1

LIU Zhihui

YU Haichao

Related Institution

State Key Laboratory of Transducer Technology,Institute of Intelligent Machines, Chinese Academy of Scienes

University of Science and Technology of China

Lausanne Federal Polytechnic University

The 49th Research Institute of China Electronics Technology Group Corporation

School of Instrument Science and Engineering, Southeast University

⁰