Micro-opto-electro-mechanical systems technologies and applications

LI Hong-guang

doi:10.13873/j.1000-97872011.11.017

Chinese

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Micro-opto-electro-mechanical systems technologies and applications

更新时间：2025-09-11

- Micro-opto-electro-mechanical systems technologies and applications
- Vol. 30, Issue 11, Pages: 1-3+7(2011)
- 作者机构：
  
  中国科学院长春光学精密机械与物理研究所
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872011.11.017
  CLC： TP211.4;TN405
- Published：2011
- 稿件说明：
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[1]李红光.微光电子机械系统技术及其应用[J].传感器与微系统,2011,30(11):1-3+7.

LI Hong-guang. Micro-opto-electro-mechanical systems technologies and applications[J]. 2011, 30(11): 1-3+7.
[1]李红光.微光电子机械系统技术及其应用[J].传感器与微系统,2011,30(11):1-3+7. DOI： 10.13873/j.1000-97872011.11.017.

LI Hong-guang. Micro-opto-electro-mechanical systems technologies and applications[J]. 2011, 30(11): 1-3+7. DOI： 10.13873/j.1000-97872011.11.017.

摘要

概述微光电子机械系统（MOEMS）技术发展历史

分析其现状。以美国陆军研究开发和工程指挥部的"战略研究规划"中的7个研究领域为例

分析MOEMS技术应用潜力和未来发展趋势。提出现在MOEMS工程遇到的技术挑战:MOEMS加工工艺

达到全反射的光学表面的加工工艺

可与电子线路和MOEMS集成兼容的CMOS半导体材料

MOEMS器件的组装。

Abstract

History and current status of advanced MOEMS technologies is presented.Potential applications and future trends on MOEMS are analyzed based on the strategic research projects in "Strategic Research Program" made by US Army Research Development and Engineering Command.Current challenges on processing of MOEMS chip

processing of optical surface of micromirrors for high resolution imaging

developing a CMOS processing to be able to integrate the electronic circuit with the MOEMS chip

bulk micromachining process and packaging of MOEMS devices are given.

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