A novel MEMS temperature sensor

SHI Zi-qing1; CHEN Xiang-dong1; GONG Jing1; LI Xiu-mei2

doi:10.13873/j.1000-97872011.09.046

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A novel MEMS temperature sensor

更新时间：2025-09-11

- A novel MEMS temperature sensor
- Vol. 30, Issue 9, Pages: 149-152(2011)
- 作者机构：
  
  1. 西南交通大学信息科学与技术学院
  2. 西南交通大学物理科学与技术学院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872011.09.046
  CLC： TP212.11
- Published：2011
- 稿件说明：
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[1]时子青,陈向东,龚静,李秀梅.一种新型MEMS温度传感器[J].传感器与微系统,2011,30(09):149-152.

SHI Zi-qing1, CHEN Xiang-dong1, GONG Jing1, et al. A novel MEMS temperature sensor[J]. 2011, 30(9): 149-152.
[1]时子青,陈向东,龚静,李秀梅.一种新型MEMS温度传感器[J].传感器与微系统,2011,30(09):149-152. DOI： 10.13873/j.1000-97872011.09.046.

SHI Zi-qing1, CHEN Xiang-dong1, GONG Jing1, et al. A novel MEMS temperature sensor[J]. 2011, 30(9): 149-152. DOI： 10.13873/j.1000-97872011.09.046.

摘要

提出了一种新型的基于硅微桥的MEMS温度传感器。传感器是由表面制有惠斯通电桥的硅微桥和淀积在其表面的温敏聚合物薄膜构成。应用弹性力学薄板理论分析了该温度传感器的模型。分析表明:硅微桥的输出与温度变化呈线性关系。在温敏薄膜材料参数已知时

采用大面积、高厚度

可以改善传感器性能。

Abstract

A novel MEMS temperature sensor employing a bi-layer film structure is presented.The sensing unit is composed of a silicon micro-bridge embedded with a piezoresistive Wheatstone bridge and a temperature sensitive polymer film.Model analysis of the temperature sensor using elastic mechanics theory is presented.Analysis shows that the output of the silicon micro-bridge is linear with temperature.Larger area and thicker thickness can improve the performance when the polymer film material parameters are known.

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references

MEMS压力传感器及其应用 [J]. 颜重光. 电子产品世界 . 2009(06)

一种新型MEMS温度传感器的设计 [J]. 陆婷婷,秦明,黄庆安. 功能材料与器件学报 . 2008(01)

扩散硅压力传感器应力计算建模 [J]. 李进军,石成英. 传感器世界 . 2004(01)

一种硅/二氧化硅双层微悬臂梁温度传感器 [J]. 韩建强,朱长纯,刘君华,魏培永. 仪器仪表学报 . 2003(05)

弹性理论[M]. 高等教育出版社 , [苏]铁摩辛柯（Timoshenko,S.）,（苏）古地尔（Goodier,J.N.）著, 1990

弹性力学[M]. 高等教育出版社 , 徐芝纶著, 1990

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