Study of packaging stress of micro-machined gyroscopes

LI Ya-shan1; YAN Jun-jie2; LIU-Jun1; SHI Yun-bo1

doi:10.13873/j.1000-97872011.04.022

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Study of packaging stress of micro-machined gyroscopes

更新时间：2025-09-11

- Study of packaging stress of micro-machined gyroscopes
- Vol. 30, Issue 4, Pages: 25-27+30(2011)
- 作者机构：
  
  1. 中北大学电子测试技术国防重点实验室
  2. 北京大学微电子学研究院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872011.04.022
  CLC： TN966
- Published：2011
- 稿件说明：
移动端阅览
[1]李亚山,闫俊杰,刘俊,石云波.微机械陀螺封装应力研究[J].传感器与微系统,2011,30(04):25-27+30.

LI Ya-shan1, YAN Jun-jie2, LIU-Jun1, et al. Study of packaging stress of micro-machined gyroscopes[J]. 2011, 30(4): 25-27+30.
[1]李亚山,闫俊杰,刘俊,石云波.微机械陀螺封装应力研究[J].传感器与微系统,2011,30(04):25-27+30. DOI： 10.13873/j.1000-97872011.04.022.

LI Ya-shan1, YAN Jun-jie2, LIU-Jun1, et al. Study of packaging stress of micro-machined gyroscopes[J]. 2011, 30(4): 25-27+30. DOI： 10.13873/j.1000-97872011.04.022.

摘要

针对设计的微机械陀螺开展了封装应力影响的研究。在对陀螺封装影响进行理论计算分析的基础上

进行了有限元仿真分析

并分析了温度变化引起的不同结构梁的谐振频率的变化

结果表明:在封装应力的影响下

陀螺的谐振频率与温度存在线性关系

不同梁结构的线性增减是不同的

基底材料和粘胶的热膨胀系数与杨氏模量是影响谐振频率变化的因素。

Abstract

The effects of packaging stress on the micro-machined gyroscopes are studied.The packgaing effect on gyroscopes is analyzed theoretically.Finite element simulation analysis is carried out to find out the effect of basis and adhesive on the gyroscope.Simulation results show that packaging stress caused by temperature will change the resonant frequency of a gyroscope and difference structure beams have different changes.The coefficient of thermal expansion and Yong’s modulus of adhesive and basis should be the factors to change resonant frequencies of a gyroscope.

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references

硅微陀螺模态频率温度特性的研究 [J]. 满海鸥,肖定邦,吴学忠,陈志华,侯占强. 传感技术学报 . 2009(08)

硅微机械陀螺仪封装应力研究 [J]. 施芹,苏岩,裘安萍,朱欣华. 电子器件 . 2007(06)

温度对硅纳米薄膜杨氏模量的影响 [J]. 谭一云,于虹,黄庆安,刘同庆. 电子器件 . 2007(03)

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