Micro-bridge structure design of UFPA detector with high sensitive pixels

FAN Mao-yan1; JIANG Sheng-lin1; XIE Tian-tian1; ZHANG Qing-feng1; ZHANG Li-fang2

doi:10.13873/j.1000-97872009.09.007

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Micro-bridge structure design of UFPA detector with high sensitive pixels

更新时间：2025-09-11

- Micro-bridge structure design of UFPA detector with high sensitive pixels
- Vol. 28, Issue 9, Pages: 97-99+103(2009)
- 作者机构：
  
  1. 华中科技大学电子科学与技术系
  2. 玉溪师范学院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872009.09.007
  CLC： TN215
- Published：2009
- 稿件说明：
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[1]范茂彦,姜胜林,谢甜甜,张清峰,张丽芳.非制冷红外焦平面高灵敏像元微桥设计[J].传感器与微系统,2009,28(09):97-99+103.

FAN Mao-yan1, JIANG Sheng-lin1, XIE Tian-tian1, et al. Micro-bridge structure design of UFPA detector with high sensitive pixels[J]. 2009, 28(9): 97-99+103.
[1]范茂彦,姜胜林,谢甜甜,张清峰,张丽芳.非制冷红外焦平面高灵敏像元微桥设计[J].传感器与微系统,2009,28(09):97-99+103. DOI： 10.13873/j.1000-97872009.09.007.

FAN Mao-yan1, JIANG Sheng-lin1, XIE Tian-tian1, et al. Micro-bridge structure design of UFPA detector with high sensitive pixels[J]. 2009, 28(9): 97-99+103. DOI： 10.13873/j.1000-97872009.09.007.

摘要

介绍了硅微桥结构的传热物理模型及其理论计算方法。提出一种厚膜像元尺寸为360μm×360μm

具有"桌形"绝热框架支撑的微桥结构像元

用有限元分析证明其有较小的热导G

能获得很高的响应率。微桥结构在非制冷红外焦平面（UFPA）单元探测器中起着力学支撑、热隔离和电连接的作用

其品质优劣直接影响着UFPA器件的成像性能。

Abstract

The physical mode and theory of the heat transfer in micro-bridge structure are introduced.A kind of micro-bridge pixel is provided with thick-film pixel size of 360μm×360μm and"desk-type"adiabatic frame support

and the analysis results by FEM show that the thermal conductivity G is small and high response rate can be obtained.The micro-bridge structure plays an important role in the mechanical support

thermal isolation and electrical connection for the UFPA detector

the quality of which has a direct effect on the imaging performance of the UFPA detector.

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references

UFPA器件的新型微桥结构设计及其有限元分析 [J]. 杨晓瑜,吴志明,蒋亚东,李素. 传感器与微系统 . 2007(01)

薄膜型热释电探测器红外响应模型分析 [J]. 白丕绩,太云见,林猷慎,胡滨,鄢知权,李平. 红外技术 . 2006(03)

(Ba 1-x Sr x )TiO 3 薄膜的制备及性能的研究 [J]. 刘梅冬,刘少波,曾亦可,李楚容,邓传益. 压电与声光 . 2001(01)

混合式非致冷焦平面器件芯片工艺研究 [J]. 黄承彩. 应用光学 . 1999(02)

传热学[M]. 高等教育出版社 , 杨世铭,陶文铨编著, 1998

传热学[M]. 高等教育出版社 , 程尚模主编, 1990

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