Electro-thermal actuator using non-silicon micro fabrication technology

ZHANG Xiao-bo; WU Yi-bo; WANG Ya-pan; ZHANG Cong-chun; DING Gui-fu

doi:10.13873/j.1000-97872009.08.012

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Electro-thermal actuator using non-silicon micro fabrication technology

更新时间：2025-09-11

- Electro-thermal actuator using non-silicon micro fabrication technology
- Vol. 28, Issue 8, Pages: 118-120(2009)
- 作者机构：
  
  上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细技术教育部重点实验室
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872009.08.012
  CLC： TH703
- Published：2009
- 稿件说明：
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[1]张小波,吴义伯,王亚攀,张丛春,丁桂甫.一种非硅微加工技术制作的电热微驱动器[J].传感器与微系统,2009,28(08):118-120.

ZHANG Xiao-bo, WU Yi-bo, WANG Ya-pan, et al. Electro-thermal actuator using non-silicon micro fabrication technology[J]. 2009, 28(8): 118-120.
[1]张小波,吴义伯,王亚攀,张丛春,丁桂甫.一种非硅微加工技术制作的电热微驱动器[J].传感器与微系统,2009,28(08):118-120. DOI： 10.13873/j.1000-97872009.08.012.

ZHANG Xiao-bo, WU Yi-bo, WANG Ya-pan, et al. Electro-thermal actuator using non-silicon micro fabrication technology[J]. 2009, 28(8): 118-120. DOI： 10.13873/j.1000-97872009.08.012.

摘要

介绍了一种由非硅微加工技术制作的电热微驱动器。基于双金属效应

采用聚合物SU—8胶和金属镍作为功能材料和结构材料

铜为牺牲层材料制作电热微驱动器。利用ANSYS有限元分析软件进行仿真

模拟驱动位移随加热时间的变化关系

并由此得出驱动力的大小

比较结果后确定结构参数。再通过光刻、掩模电镀和牺牲层刻蚀等工艺

加工制作出了电热微驱动器样品

并对样品进行了观测和分析。

Abstract

A novel electro-thermal actuator is presented by using non-silicon micro fabrication technology.It works based on bimorph effect.SU—8 and Nickel are adopted as functional materials and structural materials and copper is used as sacrificed layer material.A finite element analysis software ANSYS is adopted to simulate the variation of displacement against time and drive force is determined.A parameter of structure is designed by comparing result.Samples of device are machined through exposal

plating and etching technology.And the samples of device are tested by scanning electron microscope（SEM）.Measurement and analysis are made.

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references

金属材料手册[M]. 化学工业出版社 , 李春胜,黄德彬主编, 2005

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Related Institution

National Key Laboratory of Nano/Micro Fabrication Technology,Key Laboratory for Thin Film and Micro-fabrication of Ministry of Education,Shanghai Jiaotong University

School of Electronic Science & Applied Physics,Hefei University of Technology

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