Development of creep resistance test system for lead-free solder joints

JIANG Li1; XIANG Ke1; YANG Ke-ling1; ZHOU Jie-min2

doi:10.13873/j.1000-97872008.09.001

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Development of creep resistance test system for lead-free solder joints

更新时间：2025-09-11

- Development of creep resistance test system for lead-free solder joints
- Issue 9, Pages: 89-92(2008)
- 作者机构：
  
  1. 中南大学物理科学与技术学院
  2. 中南大学能源与动力工程学院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872008.09.001
  CLC： TM934.1
- Published：2008
- 稿件说明：
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[1]蒋礼,向可,杨科灵,周孑民.无铅焊点蠕变电阻测试系统的研制[J].传感器与微系统,2008(09):89-92.

JIANG Li1, XIANG Ke1, YANG Ke-ling1, et al. Development of creep resistance test system for lead-free solder joints[J]. 2008, (9): 89-92.
[1]蒋礼,向可,杨科灵,周孑民.无铅焊点蠕变电阻测试系统的研制[J].传感器与微系统,2008(09):89-92. DOI： 10.13873/j.1000-97872008.09.001.

JIANG Li1, XIANG Ke1, YANG Ke-ling1, et al. Development of creep resistance test system for lead-free solder joints[J]. 2008, (9): 89-92. DOI： 10.13873/j.1000-97872008.09.001.

摘要

以Sn-3.5Ag焊料制作的截面积1mm2的单个焊点试样为测试对象

基于电阻应变与裂纹生长等效模型

利用在线四探针法电阻测量技术

研制了焊点蠕变电阻测试系统。系统由测试仪、测试装置和上位机软件creep组成

实现微电阻、拉力、温度测量和测试数据的实时存储、实时应变曲线的绘制。测试结果表明:系统具有较高的稳定性

电阻测量最大相对误差为0.27%。在20

9MPa应力范围下

Sn-3.5Ag焊点试样的电阻应变—时间测试曲线清晰地展示了剪切蠕变行为的第Ⅱ

Ⅲ阶段

为观测无铅焊点剪切蠕变特性提供了一种高效、简捷的可选手段。

Abstract

Using single creep specimens with a 1mm2 cross sectional area

which are developed and fabricated with lead-free solder（Sn-3.5Ag）

as the test objects

a creep resistance test system based on the equivalent mode of resistance strain and crack developing is designed to test the resistance strain and observe the shear creep quality of solder joints

with in-situ micro electronic-resistance measurement using four-probe techniques.This test system is composed of test instrument

test device and software-creep

and it is able to measure small resistance

load

temperature and store experiment data and depict strain curve in real time.The experimental results show that this system has comparatively high stability and the largest measuring error of resistance is

0.27%.Under a shear stress of 20

9MPa

the resistance strain-time test curve for Sn-3.5Ag solder joints shows the Ⅱ and the Ⅲ stage of shear creep clearly

and the result supplies an efficient

convenient way for observing the shear creep quality of lead-free solder joints.

关键词

Keywords

references

无铅互连凸点电迁移失效的四探针测量 [J]. 吴丰顺,张伟刚,张金松,吴懿平. 华中科技大学学报(自然科学版) . 2007(06)

PT100铂电阻温度变送器 [J]. Maxim,GertN.Helles. 世界电子元器件 . 2003(08)

金属物理学[M]. 科学出版社 , 冯端等著, 1999

材料的疲劳[M]. 国防工业出版社 , (美)[休尔施]（Suresh,S.）著, 1993

Modelling of Ag 3 Sn coarsening and its effect on creep of Sn–Ag eutectics [J] . Jicheng Gong,Changqing Liu,Paul P. Conway,Vadim V. Silberschmidt. Materials Science & Engineering A . 2006 (1)

Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading [J] . Chih-Kuang Lin,Hsuan-Yu Teng. Journal of Materials Science: Materials in Electronics . 2006 (8)

Microscopic Experimental Investigation on Shear Failure of Solder Joints [J] . K. J. Lau,C. Y. Tang,P. C. Tse,C. L. Chow,S. P. Ng,C. P. Tsui,B. Rao. International Journal of Fracture . 2004 (3)

Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales [J] . M Kerr,N Chawla. Acta Materialia . 2004 (15)

Fatigue crack growth behavior of 96.5Sn–3.5Ag lead-free solder [J] . J. Zhao,Y. Miyashita,Y. Mutoh. International Journal of Fatigue . 2001 (8)

Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints [J] . J McDougall,S Choi,T.R Bieler,K.N Subramanian,J.P Lucas. Materials Science & Engineering A . 2000 (1)

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