Design mechanism

material and structure of a micromachined infrared thermopile are presented

and a 3×3 planar array is studied by MEMS process.The supporting film of thermopiles is composed of silicon nitride and silicon oxide and silicon nitride dielectric layers.Polysilicon and aluminum are adopted as thermocouple materials.Thermocouple uses parallel arrangement of the structure

and cold-end is covered by the insulation layer to improve the detection rate.Its process is compatible with the standard integrated circuit（IC）process

which makes thermoelectric infrared detector based silicon widely use.