A microfluidic temperature controller for accurate controlling temperature variation of electronic element in encapsulation process is presented.CFD software FLUENT is used to perform numerical simulation of liquid-solid-air integrative flow-heat transfer of the controller.Given inlet temperature variation condition

the temperature response behavior of the controller surface is investigated.The heat transfer efficiency

the ratio of temperature variation amplitude of solid working surface and inlet liquid are presented.The parameter effect including controller thickness

inlet liquid temperature

velocity

temperature variation shape and period on controller behavior is also studied.Numerical results indicate that the heat transfer efficiency increases as the controller thickness decreases

the inlet flow velocity increases

and period of temperature variation increases.It is also found that the heat transfer efficiency with square-shape temperature variation is higher than that with triangle-shape variation

and the temperature variation period of controller working surface is the same as the inlet liquid

but has a slight phase difference.