The die bonding process is a key process of MEMS packaging.Based on residual stress theory

the effect of Young’s modulus and thermal expansion coefficients on die bonding stress and chip warpage are studied.The results demonstrate that the Young’s modulus and thermal expansion coefficients are important parameters of affecting die bonding stress and chip warpape.The more is Young’s modulus

the inducing stress after die bonding is bigger and the chip’s warpage induced is bigger.But when Young’s modulus exceeds some a value

the stress will not increase again

and reversely

the glue has an isolating application for the stress.The bigger is CTE

the stress induced after the die bonding and curing is smaller

and the chip’s warpager induced is also smaller

and reversely

the chip’s warpage induced is bigger.Under the conditions of satisfying adhesive strength and process requirements

selecting soft glue is favorable for decreasing stress and chip’s warpager.