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Study of off-chip tensile test experimental facility for micro-component mechanical property
更新时间:2025-09-11
    • Study of off-chip tensile test experimental facility for micro-component mechanical property

    • Issue 7, Pages: 99-101+110(2007)
    • DOI:10.13873/j.1000-97872007.07.038    

      CLC: TH87
    • Published:2007

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  • SHEN Hong-yuan, CHU Jin-kui, ZHANG Duan-qin, et al. Study of off-chip tensile test experimental facility for micro-component mechanical property[J]. 2007, (7): 99-101+110. DOI: 10.13873/j.1000-97872007.07.038.

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Related Institution

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