Anodic bonding strength and its evaluation

CAO Xing; LI Hong; DU Yun

doi:10.13873/j.1000-97872007.03.003

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Anodic bonding strength and its evaluation

更新时间：2025-09-11

- Anodic bonding strength and its evaluation
- Issue 3, Pages: 10-12+16(2007)
- 作者机构：
  
  1. 武汉理工大学硅酸盐材料教育部重点实验室
  2. 武汉理工大学硅酸盐材料教育部重点实验室,湖北,武汉,430070
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872007.03.003
  CLC： TH703
- Published：2007
- 稿件说明：
移动端阅览
[1]曹欣,李宏,杜芸.阳极键合强度及其评价方法[J].传感器与微系统,2007(03):10-12+16.

CAO Xing, LI Hong, DU Yun. Anodic bonding strength and its evaluation[J]. 2007, (3): 10-12+16.
[1]曹欣,李宏,杜芸.阳极键合强度及其评价方法[J].传感器与微系统,2007(03):10-12+16. DOI： 10.13873/j.1000-97872007.03.003.

CAO Xing, LI Hong, DU Yun. Anodic bonding strength and its evaluation[J]. 2007, (3): 10-12+16. DOI： 10.13873/j.1000-97872007.03.003.

摘要

阳极键合作为一种在微机电系统（MEMS）中运用的关键技术

具有工艺简单、键合强度高、密封性好等优点。经过几十年的发展

该技术在键合机理和提高与评价键合强度等诸多方面都得到了很大的发展

并应用于越来越多的领域。对阳极键合技术的机理、键合基片材料的发展以及键合强度的评价方法等方面进行了综述和评价

并对阳极键合技术在MEMS中的发展趋势作出展望。

Abstract

Anodic bonding is the key technology of MEMS.This kind of technology has some advantages

such as simply technics

higher bonding strength

the good capability of airproof.For several decades

the technology has some improvement in mechanism of bonding and the measurement of bonding strength.The mechanism of bonding

material of improvement bonding and the evaluation method of bonding strength are summarized.The development of this technology which used in MEMS is expected.

关键词

Keywords

references

微米尺度下键合强度的评价方法和测试结构 [J]. 阮勇,贺学锋,张大成,王阳元. 微电子学与计算机 . 2005(08)

静电键合用微晶玻璃研究 [J]. 崔竹,高锡平,黄幼榕. 中国建材科技 . 2004(03)

静电键合用微晶玻璃的研究 [J]. 常鹰,卢安贤. 中南工业大学学报(自然科学版) . 2003(05)

采用线阴极的快速阳极键合方法 [J]. 吴登峰,邬玉亭,褚家如,张淑珍. 传感器技术 . 2003(05)

微晶玻璃[M]. 化学工业出版社 , 程金树[等]编著, 2006

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