A uniaxial tensile test method for measuring mechanical properties of MEMS thin film materials is presented.Its characterizations are the both-ends fixed specimen and the integrated loading mechanism on the substrate;therefore it can eliminate the troublesomeness of manipulating and aligning the specimen.The on-chip device is microfabricated by wet etching

and the silicon specimen is shaped by dry etching;yet the metal specimen is shaped by electroplating.The experiments show that using this method can conduct simply

precisely tensile test on thin film specimens and obtain their mechanical properties.It can provide reliable parameters for designing and analyzing MEMS devices.