Research and applications of adhesion in micromachined accelerometer

YU Bi-qiang; WENG Hai-shan; LI Jiang

doi:10.13873/j.1000-97872006.06.014

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Research and applications of adhesion in micromachined accelerometer

更新时间：2025-09-11

- Research and applications of adhesion in micromachined accelerometer
- Issue 6, Pages: 43-45+48(2006)
- 作者机构：
  
  1. 北京科技大学机械工程学院
  2. 北京科技大学机械工程学院,北京,100083
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872006.06.014
  CLC： TH824.4
- Published：2006
- 稿件说明：
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[1]俞必强,翁海珊,李疆.微加速度计粘附问题的研究及应用[J].传感器与微系统,2006(06):43-45+48.

YU Bi-qiang, WENG Hai-shan, LI Jiang. Research and applications of adhesion in micromachined accelerometer[J]. 2006, (6): 43-45+48.
[1]俞必强,翁海珊,李疆.微加速度计粘附问题的研究及应用[J].传感器与微系统,2006(06):43-45+48. DOI： 10.13873/j.1000-97872006.06.014.

YU Bi-qiang, WENG Hai-shan, LI Jiang. Research and applications of adhesion in micromachined accelerometer[J]. 2006, (6): 43-45+48. DOI： 10.13873/j.1000-97872006.06.014.

摘要

粘附是影响微机电系统（MEMS）可靠性的重要因素之一。针对MEMS的典型产品——微加速度计的粘附问题进行了研究

给出了2种典型的微加速度计的表征粘附特性的剥离数的表达式

并分析了将粘附条件应用于微加速度计的多学科设计优化之中

分析了其对系统结构设计产生的影响。

Abstract

Adhesion is one of the reliability problems in MEMS.The adhesion problem of the representative MEMS product-micromachined accelerometer is studied

and expressions of peel number are proposed to predict the adhesion-related performance for two kinds of micromachined accelerometers.The peel number is used in multidisciplinary design optimization of micromachined accelerometer

and its influence on the structure design is discussed.

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references

微电子机械系统中的若干固体力学问题 [J]. 张向军,孟永钢,温诗铸. 力学与实践 . 2003(02)

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Related Author

YUE Lu-you1

HE Xing-chun1

DING Jian-ning1

YANG Ji-chang1

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Related Institution

School of Mechanical Engineering, Jiangsu University

School of Mechanical and New Energy Engineering,Changzhou University

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