Review of semiconductor temperature sensors development

ZHANG Xun; JIN Dong-ming; LIU Li-tian

doi:10.13873/j.1000-97872006.03.001

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Review of semiconductor temperature sensors development

更新时间：2025-09-11

- Review of semiconductor temperature sensors development
- Issue 3, Pages: 1-3(2006)
- 作者机构：
  
  1. 清华大学微电子所
  2. 清华大学微电子所,北京,100084
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-97872006.03.001
  CLC： TP212
- Published：2006
- 稿件说明：
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[1]张洵,靳东明,刘理天.半导体温度传感器研究进展综述[J].传感器与微系统,2006(03):1-3.

ZHANG Xun, JIN Dong-ming, LIU Li-tian. Review of semiconductor temperature sensors development[J]. 2006, (3): 1-3.
[1]张洵,靳东明,刘理天.半导体温度传感器研究进展综述[J].传感器与微系统,2006(03):1-3. DOI： 10.13873/j.1000-97872006.03.001.

ZHANG Xun, JIN Dong-ming, LIU Li-tian. Review of semiconductor temperature sensors development[J]. 2006, (3): 1-3. DOI： 10.13873/j.1000-97872006.03.001.

摘要

半导体温度传感器体积小、功耗低

且能与其他外围控制电路集成在同一芯片上

其应用领域广阔。评述了各种半导体温度传感器的基本实现方式、发展现状

总结了现有各种设计方法中的关键技术及其存在的问题和改进方向。

Abstract

The semiconductor temperature sensor is miniature

low power dissipation

and it can be integrated with other peripheral control circuits on the same chip

it has wide application prospects.The basic realization way and the current situation developed of different semiconductor temperature sensors is explained.The key technology and existing problem in various kinds of present design

methods and the improved direction are also summarized.

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