Design and test of capacitive micro ultrasonic transducer based on wafer to wafer bonding

YANG Le; ZHANG Ya

doi:10.13873/j.1000-9787(2019)02-0066-03

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Design and test of capacitive micro ultrasonic transducer based on wafer to wafer bonding

更新时间：2025-09-11

- Design and test of capacitive micro ultrasonic transducer based on wafer to wafer bonding
- Issue 2, Pages: 66-68(2019)
- 作者机构：
  
  中北大学机电工程学院
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-9787(2019)02-0066-03
  CLC： TB552
- Published：2019
- 稿件说明：
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YANG Le, ZHANG Ya. Design and test of capacitive micro ultrasonic transducer based on wafer to wafer bonding[J]. 2019, (2): 66-68.
DOI：

YANG Le, ZHANG Ya. Design and test of capacitive micro ultrasonic transducer based on wafer to wafer bonding[J]. 2019, (2): 66-68. DOI： 10.13873/j.1000-9787(2019)02-0066-03.

摘要

通过测试电容值的变化来分析电容式微超声波换能器(CMUT)的发射性能。介绍了CMUT的工艺过程

关键工艺为硅硅键合。利用硅硅键合工艺制作的CMUT误差小、工艺流程简单且能进行量产。利用E4990A阻抗分析仪测试CMUT电容值得到CMUT初始电容值为680 p F

阵列内电容值一致性良好

误差为0. 62 p F

并对所设计的CMUT进行带宽测试

得出其在-6 d B时归一化带宽为200%

远远优于现有的传感器。

Abstract

By testing the change of capacitance

analyze on transmitting performance of capacitive micro ultrasonic transducer（CMUT）. The process is described in detail. Key process is wafer to wafer bonding. It has advantages of small error

simple process and mass production. By using the E4990 A

impedance analyzer

test capacitance of CMUT

initial capacitance 680 p F is obtained in the array

capacitance consistency is good

the error is 0. 62 p F

bandwidth of the designed test

the normalized bandwidth is 200 % at-6 d B

which is prior to the existing sensors.

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