Wafer dies counting method based on machine vision

TIAN Qi; ZHANG Ling

doi:10.13873/j.1000-9787(2018)10-0041-03

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Wafer dies counting method based on machine vision

更新时间：2025-09-11

- Wafer dies counting method based on machine vision
- Issue 10, Pages: 41-43(2018)
- 作者机构：
  
  1. 江苏信息职业技术学院机电工程学院
  2. 南京启宸智能技术有限公司
- 作者简介：
- 基金信息：
- DOI：10.13873/j.1000-9787(2018)10-0041-03
  CLC： TN305;TP391.41
- Published：2018
- 稿件说明：
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TIAN Qi, ZHANG Ling. Wafer dies counting method based on machine vision[J]. 2018, (10): 41-43.
DOI：

TIAN Qi, ZHANG Ling. Wafer dies counting method based on machine vision[J]. 2018, (10): 41-43. DOI： 10.13873/j.1000-9787(2018)10-0041-03.

摘要

在半导体加工行业

为了解决人工计算晶圆裸片数量速度慢、劳动强度大等问题

提出了一种基于机器视觉的晶圆裸片自动计数方法:使用Sobel算子对晶圆图像进行边缘检测;通过行扫描和随机抽样一致性(RANSAC)算法对晶圆进行定位;采用改进的RANSAC算法进行切割线的粗拟合;切割线的精确拟合

并利用切割线的交点信息计算晶圆裸片的数量。实验结果表明:对于晶圆裸片的自动计数

提出的方法稳定性好

拥有良好的效率和精度

具有很好的实用价值。

Abstract

In semiconductor processing industry

manual calculation of number of wafer dies is inefficient and labour-intensive. In order to solve this problem

a machine vision-based autocounting method for wafer dies is presented. Firstly

the method uses Sobel operator to detect the edge of the wafer image. Then

row scanning and random sample consensus（ RANSAC） algorithm are used to locate the wafer. And then

improved RANSAC algorithm is used to roughly fit the dicing lines. Finally

the dicing lines are accurately fitted and the number of wafer dies is calculated by using the intersection points information of the dicing lines. The experimental results show that the method is stable and it has good efficiency and precision. It has good practical value for wafer dies auto counting.

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