您当前的位置:
首页 >
文章列表页 >
Design of testing device for mechanical properties of micro-component
更新时间:2025-09-11
    • Design of testing device for mechanical properties of micro-component

    • Issue 7, Pages: 66-69(2018)
    • DOI:10.13873/j.1000-9787(2018)07-0066-04    

      CLC: TB301;TP212
    • Published:2018

    移动端阅览

  • DONG Ao-xue, QU Da, WANG Bo. Design of testing device for mechanical properties of micro-component[J]. 2018, (7): 66-69. DOI: 10.13873/j.1000-9787(2018)07-0066-04.

  •  
  •  
icon
试读结束,您可以激活您的VIP账号继续阅读。
去激活 >
icon
试读结束,您可以通过登录账户,到个人中心,购买VIP会员阅读全文。
已是VIP会员?
去登录 >

0

Views

98

下载量

1

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Research on mechanical properties of thin films based on bulge test
Tensile test system of thin-film material based on virtual instruments
Study on mechanical properties of Ni-W alloy films in micro-electro-mechanical system
Study of off-chip tensile test experimental facility for micro-component mechanical property

Related Author

XIU Qiang
ZHANG Chong
MA Shu-jun
LI Lu-lu
HUANG Hai-tao
WU Qiang
ZHU Yu-tian
XING Xing

Related Institution

School of Mechanical Engineering & Automation,Northeastern University
School of Mechanical Engineering,Tongji University
National Key Laboratory of Micro/Nano Fabrication Technology,Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education,Research Institute of Micro/Nano Science and Technology,Shanghai Jiao Tong University
Key Laboratory for Micro /Nano Technology and System of Liaoning Province,Key Laboratory for Precision & Non-traditional Machining,Ministry of Education,Dalian University of Techonology
大连理工大学精密与特种加工教育部重点试验室辽宁省微纳米技术及系统重点试验室
0