您当前的位置:
首页 >
文章列表页 >
Design and implementation of a piezoresistive micro pressure sensor chip
更新时间:2025-09-11
    • Design and implementation of a piezoresistive micro pressure sensor chip

    • Issue 6, Pages: 73-74+78(2018)
    • DOI:10.13873/j.1000-9787(2018)06-0073-02    

      CLC: TP212
    • Published:2018

    移动端阅览

  • WU Zuo-fei, YIN Yan-zhao, TIAN Lei, et al. Design and implementation of a piezoresistive micro pressure sensor chip[J]. 2018, (6): 73-74+78. DOI: 10.13873/j.1000-9787(2018)06-0073-02.

  •  
  •  
icon
试读结束,您可以激活您的VIP账号继续阅读。
去激活 >
icon
试读结束,您可以通过登录账户,到个人中心,购买VIP会员阅读全文。
已是VIP会员?
去登录 >

0

Views

320

下载量

5

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

MEMS SOI high temperature pressure sensor chip
Application of wafer-level laminated bonding technology in SOI high-temperature pressure sensor

Related Author

GUO Yu-gang
RAO Hao
TAO Mao-jun
TIAN Lei
WU Zuo-fei
QI Hong
DING Wen-bo
ZHANG Song

Related Institution

Control System Institute of Aero Engine Corporation of China
The 49th Research Institute of China Electronics Technology Group Corporation
Military Representative Office of the Rocket Army at Harbin
The 49th Research Institute of China Electronics Technology Group Corporation
0