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Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.,Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.,Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,School of Materials Science and Engineering, Tsinghua University, Beijing, China.,NeuroLux Corporation, Evanston, IL, USA.,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.,NeuroLux Corporation, Evanston, IL, USA.,Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA.,PSYONIC, Inc., Champaign, IL, USA.,Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.,Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China.,Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.,Bristol Composites Institute, University of Bristol, Bristol, UK.,Wearifi, Inc., Evanston, IL, USA.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA.,AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics 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