Research and fabrication of MEMS thin-film heat flux sensor

LI Juan; ZHANG Congchun; YANG Shenyong; DING Guifu; DONG Wei; DUAN Li

doi:10.13873/J.1000-9787(2019)05-0071-03

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Research and fabrication of MEMS thin-film heat flux sensor

更新时间：2025-09-11

- Research and fabrication of MEMS thin-film heat flux sensor
- Issue 5, Pages: 71-73(2019)
- 作者机构：
  
  1. 上海交通大学微米/纳米加工技术重点实验室
  2. 上海交通大学电子信息与电气工程学院微纳电子学系
  3. 上海交通大学机械与动力工程学院
- 作者简介：
- 基金信息：
- DOI：10.13873/J.1000-9787(2019)05-0071-03
  CLC： TP212
- Published：2019
- 稿件说明：
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LI Juan, ZHANG Congchun, YANG Shenyong, et al. Research and fabrication of MEMS thin-film heat flux sensor[J]. 2019, (5): 71-73.
DOI：

LI Juan, ZHANG Congchun, YANG Shenyong, et al. Research and fabrication of MEMS thin-film heat flux sensor[J]. 2019, (5): 71-73. DOI： 10.13873/J.1000-9787(2019)05-0071-03.

摘要

基于微加工技术设计制备了一种微机电系统(MEMS)薄膜热流传感器。采用COMSOL软件

对不同结构参数MEMS薄膜热流计进行仿真模拟

通过对仿真结果对比和分析

优化热流传感器的设计参数。根据优化的设计参数利用MEMS工艺制备薄膜热流计。搭建了标定系统

对所制备的MEMS薄膜热流计进行性能测试和标定。实验结果表明:薄膜热流计的电压输出响应曲线的变化趋势和仿真结果一致

此外

薄膜热流计的输出电压和热流密度呈良好的线性关系。

Abstract

Based on micromachining technology

a micro-electro-mechanical system（ MEMS） thin-film thermopile（ TFTP） heat flux senor is designed and fabricated. The property of TFTPs with different structure is modeled and analyzed by FEA COMSOL in order to obtain the best sensor performance with a smaller device dimensions. The MEMS TFTPs are proposed and manufactured based on the optimized design. The testing system has been built to characterize the performance of fabricated TFTPs. It can be found that the output voltage responses are consistent with simulation results when a step heat flux applied. The test results also show that the output voltage of TFTPs responded linearly with heat flux.

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