Sputtering process research of multilayer metal thin film in MEMS devices

ZHANG Xu; LUO Xin-jie; HOU Zhan-qiang; XIAO Ding-bang; WU Xue-zhong

doi:10.13873/J.1000-9787(2018)01-0011-04

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Sputtering process research of multilayer metal thin film in MEMS devices

更新时间：2025-09-11

- Sputtering process research of multilayer metal thin film in MEMS devices
- Issue 1, Pages: 11-14(2018)
- 作者机构：
  
  1. 国防科技大学机电工程与自动化学院
  2. 北京大学信息科学技术学院
- 作者简介：
- 基金信息：
- DOI：10.13873/J.1000-9787(2018)01-0011-04
  CLC： TH-39
- Published：2018
- 稿件说明：
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ZHANG Xu, LUO Xin-jie, HOU Zhan-qiang, et al. Sputtering process research of multilayer metal thin film in MEMS devices[J]. 2018, (1): 11-14.
DOI：

ZHANG Xu, LUO Xin-jie, HOU Zhan-qiang, et al. Sputtering process research of multilayer metal thin film in MEMS devices[J]. 2018, (1): 11-14. DOI： 10.13873/J.1000-9787(2018)01-0011-04.

摘要

溅射工艺是制作微机电系统(MEMS)器件金属薄膜的主要方式

金属薄膜作为MEMS器件中的掩模层和功能层

要求薄膜应力小

粘附性、均匀性和可焊性好。通过对常用金属薄膜材料特性、多层金属薄膜溅射工艺和质量评价方法的研究得出了优化工艺的的方法

提高了多层金属薄膜的质量。

Abstract

Sputtering process is the main way to fabricate metal thin film of micro-electro-mechanical system（MEMS） device. Metal thin film is the mask and functional layer of MEMS device

which requires that the film has small stress

good adhesion

uniformity and weldability. By researching on characteristics of common metal thin film material

sputtering process and quality evaluation methods of multilayer metal thin film

method for process optimizing is obtained

and the quality of multilayer metal thin film is improved.

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