Miniaturization of antenna play an important role in increasing integration of microwave packaging system performance improving

and reducing cost. A novel miniaturized antenna is designed introducing fractal structure into general slot folded antenna

the goal of miniaturization is achieved by loading self-similar fractal structure

furthermore

a kind of high resistance structure processed by etching and oxidation is chosen as substrate

which is better than the substrate with back-etching cavity. The area of antenna based on the high resistance substrate is only 22 % of that based on substrate with back-etching cavity. The antenna works in Ku band. Modeling and simulation is carried out by ANSYS HFSS. Second-order fractal structure specimen is manufactured on the MEMS processing platform

and process is given

and is key step introduced

comparison of simulation result and test result are given.