Vacuum packaging research of optically readable infrared imaging chip

ZHANG Yun-sheng; FENG Fei; WEI Xu-dong; GE Xiao-hong; WANG Yue-lin

doi:10.13873/J.1000-9787(2015)02-0044-03

Chinese

您当前的位置：

首页 >

文章列表页 >

Vacuum packaging research of optically readable infrared imaging chip

更新时间：2025-09-11

- Vacuum packaging research of optically readable infrared imaging chip
- Vol. 34, Issue 2, Pages: 44-46(2015)
- 作者机构：
  
  1. 中国科学院上海微系统与信息技术研究所
  2. 中国科学院大学
- 作者简介：
- 基金信息：
- DOI：10.13873/J.1000-9787(2015)02-0044-03
  CLC： TN215
- Published：2015
- 稿件说明：
移动端阅览
[1]张云胜,冯飞,魏旭东,戈肖鸿,王跃林.光读出红外成像芯片真空封装研究[J].传感器与微系统,2015,34(02):44-46.

ZHANG Yun-sheng, FENG Fei, WEI Xu-dong, et al. Vacuum packaging research of optically readable infrared imaging chip[J]. 2015, 34(2): 44-46.
[1]张云胜,冯飞,魏旭东,戈肖鸿,王跃林.光读出红外成像芯片真空封装研究[J].传感器与微系统,2015,34(02):44-46. DOI： 10.13873/J.1000-9787(2015)02-0044-03.

ZHANG Yun-sheng, FENG Fei, WEI Xu-dong, et al. Vacuum packaging research of optically readable infrared imaging chip[J]. 2015, 34(2): 44-46. DOI： 10.13873/J.1000-9787(2015)02-0044-03.

摘要

为解决光读出红外成像焦平面阵列器件的真空封装

提出了一种新颖的真空封装方法。该封装结构由可见光窗口、硅垫片和红外窗口三部分构成。硅垫片和可见光窗口（玻璃）通过阳极键合形成封装腔体

用于放置芯片;红外窗口不仅选择性增透8

4μm波段的红外辐射

且作为封装盖板;封装腔体和红外窗口在真空室内通过焊料键合完成真空封装。该封装结构通过了气密检测

并测试得到了200℃电烙铁热像图。

Abstract

A novel vacuum packaging method is proposed for vacuum packaging optically readable infrared imaging focal plane array（ ORIRFPA） device. The vacuum packaging structure is made up of three parts

a visible light window

a silicon spacer

and an infrared window. The silicon spacer is bonded to visible light window-glass using anodic bonding to form packaging cavity

for chip placement; infrared window is not only used to selectively transmit infrared radiation ranges from 8 μm to 14 μm

but also is used as packaging cover board; packaging cavity is solder bonded to infrared window in vacuum chamber. Then the packaging structure passes air tightness test

and thermal images of soldering iron at temperature 200 ℃ are test and obtained.

关键词

Keywords

references

微机械光读出红外成像阵列器件机械特性对其性能的影响 [J]. 杨广立,冯飞,熊斌,王跃林. 光学精密工程 . 2007(05)

一种新颖的基于MEMS技术的光读出热成像系统性能分析与制作 [J]. 冯飞,焦继伟,熊斌,王跃林. 红外与毫米波学报 . 2004(02)

微机械反射式光读出非制冷红外成像阵列器件研究 [D]. 杨广立. 中国科学院研究生院（上海微系统与信息技术研究所） 2007

Views

131

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Research on residual stress of anodic bonding process of SOI pressure sensor

Anodic bonding of glass-silicon-glass three-layer structure with Si₃N₄ thin film

Design and experimental research on vacuum packaging of MEMS gyroscope based on braze welding

Research on wafer-lever vacuum package by glass frit at low temperature

Study on multi-stack anodic bonding using two electrodes

Related Author

WU Zuo-fei

ZHANG Lin-chao

WANG Ming-wei

LI Yu-ling

GUO Hang1

ZENG Yi-bo2

LIU Qi2

WANG Sheng-gui2

Related Institution

The 49th Research Institute of China Electronics Technology Group Corporation

School of Physics and Mechanical and Electrical Engineering,Xiamen University

Tung Sah Institute of Micro-Nano Science and Technology,Xiamen University,Xiamen

Department of Precision Instruments and Mechanology,Tsinghua University

State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences

⁰