Research on packaging technology of large-size
SQUID magnetic sensor

MA Yingxian; LI Hua; ZHANG Shulin; SUN Limin

Chinese

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Research on packaging technology of large-size SQUID magnetic sensor

Research & Approach | 更新时间：2026-07-20

- Research on packaging technology of large-size SQUID magnetic sensor
- Vol. 45, Issue 7, Pages: 24-28(2026)
- 作者机构：
  
  1. 上海大学微电子学院,上海,200444
  2. 中国科学院上海微系统与信息技术研究所,上海,200050
- 作者简介：
- 基金信息：
- DOI：
  CLC： TP212;TQ323
- Published：2026
- 稿件说明：
移动端阅览
MA Yingxian, LI Hua, ZHANG Shulin, et al. Research on packaging technology of large-size SQUID magnetic sensor[J]. 2026, 45(7): 24-28.
DOI：

MA Yingxian, LI Hua, ZHANG Shulin, et al. Research on packaging technology of large-size SQUID magnetic sensor[J]. 2026, 45(7): 24-28. DOI：

摘要

为保证大尺寸超导量子干涉器（SQUID）磁强计流片后测试、调试及液氦温度下系统长期稳定工作，需要对其进行适当的封装保护。首先进行了有限元仿真，研究灌封胶的热膨胀系数对封装应力的影响；根据仿真结果，制备了掺杂填料的灌封胶。使用制备的灌封胶

对磁强计进行封装

并进行测试。结果显示，灌封胶热膨胀系数越低，温度循环后引线连接断连率越低，且经过-196℃与室温间的10次温度循环后

磁强计的本征噪声与临界电流均未发生明显变化。这说明本文提出的封装方法可适用于大尺寸SQUID磁强计的封装保护。

Abstract

In order to ensure the testing

debugging and the long-term stable operation of large-size superconducting quantum interference device(SQUID)magnetometer at liquid helium temperature after tape-out

appropriate packaging protection is required.Firstly

finite element simulation is carried out to study the effect of thermal expansion coefficient of potting adhesive on packaging stress.According to the simulation results

the potting adhesive doped with filler is prepared.The magnetometer is packaged by adopting prepared potting adhesive and tests are carried out.The results show that the lower the coefficient of thermal expansion of potting adhesive

the lower the disconnection rate of leads after temperature cycling

and the intrinsic noise and critical current of the magnetometer do not change significantly after 10 temperature cycles between -196℃ and room temperature.This shows that the proposed packaging method is suitable for the packaging protection of large-size SQUID magnetometer.

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