An integrated navigation microsystem

system in package(SiP)

is designed for intelligent driving platforms in order to achieve integration and miniaturization of integrated navigation.The design of SiP modules needs to address issues such as poor heat dissipation performance

stress warpage

and reliability.Therefore

the designs of the packaging

layout

and stacking of SiP modules are focused on.Simulation software is used for modeling and simulation of the entire microsystem.The simulation results show that when the actual operation temperature

the module operates at room temperature rise is 30℃; The warpage is 0.068%

which is far less than 0.75%.The maximum stress point is located at the corner of the solder pad

and the lifetime of the solder joint is predicted based on the Manson-Coffin model

reaching 1125 cycles

meeting the requirements.