WANG Wei-kang, YUAN Wei-zheng, REN Sen, et al. Research on pyrex 7740 glass deep etching mask[J]. 2014, 33(6): 15-18. DOI: 10.13873/j.1000-97872014.06.015.
Glass wet deep etching mask often uses LPCVD poly-silicon or Cr /Au metal layer combined with photoresist
which will induce stress in glass and affect the late application such as anodic bonding. Besides
Cr / Au is expensive. In order to avoid above shortcomings
protective coating SX AR—PC 5000 /40 combined with WBR2075 dry film is introduced as a new etching mask. Lots of experiments are investigated in HF︰NH4F
HF︰ HCl
HF︰HCl︰NH4F etching solution. It is shown by the experiments that SX AR—PC 5000 /40 has strong resistance to corrosion
and deep etching on pyrex 7740 glass of depth of 131 μm is obtained. The whole process is compatible with standard IC process and can be batch fabricated at wafer-level. Experimental result has reference function for fabrication of some MEMS device
A new masking technology for deep glass etching and its microfluidic application [J] . Minqiang Bu,Tracy Melvin,Graham J. Ensell,James S. Wilkinson,Alan G.R. Evans. Sensors & Actuators: A. Physical . 2004 (2)
A new fabrication method for borosilicate glass capillary tubes with lateral inlets and outlets [J] . M.-A Grétillat,F Paoletti,P Thiébaud,S Roth,M Koudelka-Hep,N.F de Rooij. Sensors & Actuators: A. Physical . 1997 (1)