The residual thermal stress in anodic bonding of multi-ranged accelerometer can cause zero imbalance of the accelerometer

but also one of the factors that lead to the failure of the accelerometer.Residual thermal stress generated in the process of anodic bonding is studied

and at the same time

the effect of residual stress and bonding temperature

the thickness of the glass substrate and the frame bonding width are simulated and analyzed

the best width of frame and thickness of the glass substrate are determined.