Crystal silicon is the most important semiconductor material

which is mainly used in microelectronics technology.With development of microelectronics technology

the technology demanding of cutting silicon wafer is becoming increasingly.In actual operation

cutting gap width of silicon wafer is paid more attention

so as to reduce wafer loss.Pulse width of CO2 laser cutting machine

frequency and effect of cutting speed on cutting width of silicom wafer are researched

in order to achieve high efficient

small width and high standard laser cutting.