中国计量学院
纸质出版:2012
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[1]张雯,李东升,禹静,尹健龙.气体静压导轨气膜厚度的电容式测试方法[J].传感器与微系统,2012,31(07):67-69+83.
ZHANG Wen, LI Dong-sheng, YU Jing, et al. Capacitive measuring method of air-film thickness of aerostatic bearing[J]. 2012, 31(7): 67-69+83.
[1]张雯,李东升,禹静,尹健龙.气体静压导轨气膜厚度的电容式测试方法[J].传感器与微系统,2012,31(07):67-69+83. DOI: 10.13873/j.1000-97872012.07.003.
ZHANG Wen, LI Dong-sheng, YU Jing, et al. Capacitive measuring method of air-film thickness of aerostatic bearing[J]. 2012, 31(7): 67-69+83. DOI: 10.13873/j.1000-97872012.07.003.
气体静压导轨是超精密工程的核心基础技术之一
其气膜振动是影响加工精度的主要因素。提出了一种气体静压导轨气膜厚度的电容式测试方法
将气体静压导轨的节流器工作底面与实验台面当作电容式传感器的2个极板
当气膜厚度发生变化时
电容将产生较大变化。通过测量节流器与工作面间的电容
计算得到气膜厚度值。同时建立了不同凹面节流器电容与气膜厚度的数学模型。实验利用电容测量仪与电感测微测头同时对气膜厚度进行测量
结果显示两者误差为0.42μm
为气体静压导轨气膜厚度的测量提供了新的方法。
The aerostatic bearing is one of the basic core techniques in the ultra-precision engineering
and the air-film vibration is one of the main factor affecting the manufacturing precision.A capacitive testing method for air-film thickness of aerostatic bearing is proposed
which takes the working surfaces of both the aerostatic reducer and the experiment table as two plates of the capacitive sensor.The capacitance greatly varies with the air-film thickness
thus the air-film thickness can be calculated by measuring the capacitance between them.Meanwhile
mathematical models concerning the capacitance and the air-film thickness of different concave reducer are established.In the experiments
the air-film thickness is measured by both the capacitance meter and the inductance micrometer simultaneously
and the results show that the error between two measuring values is 0.42 μm.It offers a new method for measuring the air-film thickness of the aerostatic bearing.
纳米测量系统气体轴承瞬态研究 [J]. 高思田,卢明臻,施玉书,崔建军,杜华. 机械强度 . 2009(04)
高精度电容测微仪关键技术 [J]. 李建文,刘书亮,付敬业,周涛,郑义忠. 天津大学学报 . 2004(09)
超精密气浮式电容传感器系统 [J]. 戴一帆,王新峰,吴宇列. 国防科技大学学报 . 1999(05)
气体静压导轨气膜厚度和气膜刚度的电容式测试方法 [P]. 李东升,方波,禹静,满楠,张雯. 中国专利:CN101706247A,
Simulation of air gap vibration on aero-static bearing under flow/structure coupled conditions[C]] . Wang Q,Wu J J,Li D S. The5th International Symposium on Instrumentation Science andTechnology . 2008
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