In order to solve the problem of low reliability and strain transmission efficiency of optical fiber sensor packaged with epoxy adhesive

a system for metallization bonding of optical fiber sensor based on particle diffusion mechanism is developed to research package technology of optical fiber sensor without epoxy adhesive.To improve bonding strength between metal bonding layer and substrate

orthogonal test scheme of four levels is designed with four factors which are working distance

driving voltage

feeding rate

air pressure of particle field and bonding strength is evaluated by scratch test.The primary and secondary factors which influence on the bonding strength of metal bonding layer and substrate are acquired by the method of statistical analysis and metallization bonding technique of optical fiber sensor is optimized.