To solve the poor digital imaging quality and defect detection problem of solder joint of BGA device in the printed circuit board.A high-resolution X-ray flaw detection system is designed

using MeteorII-CameraLink acquisition card

HAWK-160XI X-ray source and UNIQ—1800 CCD camera.On the basis of analyzing the contribution of the ray source focal size to the imaging results

the parameters that best imaging results needed is calculated.For superposition denoise of real-time collection

the frame integral superposition method suitable for industrial applications is proposed to realize superposition function.And good real-time effects for superposition display of captured image is achieved.By testing

the systemic resolution of optimal magnification achieves 17 lp/mm

the minimum resolution of defect analysis precision achieves 0.03mm

and the result picture of collection test is given.