The effects of packaging stress on the micro-machined gyroscopes are studied.The packgaing effect on gyroscopes is analyzed theoretically.Finite element simulation analysis is carried out to find out the effect of basis and adhesive on the gyroscope.Simulation results show that packaging stress caused by temperature will change the resonant frequency of a gyroscope and difference structure beams have different changes.The coefficient of thermal expansion and Yong’s modulus of adhesive and basis should be the factors to change resonant frequencies of a gyroscope.