A residual stress measurement method which combines electronic speckle pattern interferometry（ESPI）technique with the hole-drilling method is proposed

and a set of device for measuring residual stress is designed.In the device

semiconductor laser is used to produce a compact two-beam interference optical path which maked the device small in size and convenient for installation and measurement.The optical path and CCD in the facility are installed on a clinoplane to avoid the drilling direction

and to realize real-time measurement of residual stresses.Experiments have been carried out to measure single-direction residual compress stress

and the method has been proved to be feasible by comparing experiment results with actual values.