GUO Hui-fang1, LI Jin-ming1, LIU Jun1. Dynamic analysis of capacitive micromechanical silicon gyroscope with three frames[J]. 2008, (5): 24-26. DOI: 10.13873/j.1000-97872008.05.002.
三框架电容式硅微机械陀螺动力学分析
摘要
为了解决双框架陀螺在加工中不可避免的误差
提出了三框架电容式微机械陀螺系统。该系统由3个框架(即3个质量块)组成。采用静电差分驱动方式
梳状叉指电容
多个柔性杆设计使得该结构从理论分析和加工误差上解决了耦合现象。同时
通过提高中间框架的质量
使得陀螺的灵敏度大大提高。介绍了该三框架电容式微机械陀螺仪的工作原理
给出了所设计陀螺动力学方程的详尽推导和MAT-LAB仿真分析。
Abstract
In order to solve the inevitable error in the machining of silicon micromechanical gyroscope with double frames
the system of capacitive micromechanical gyroscope with three frames is put forward.With static electronic differential driving
comb-finger capacitance
more flexible poles
the gyroscope solves the coupling from theory analysis and processing error.The sensitivity of gyroscope is improved by improving the mass of middle frame.The principle of the gyroscope is presented.Detailed dynamic equation and MATLAB simulation a analysis are also presented.