A novel bridge U-multi-level structure which is applied to uncooled infrared focal plane array（UFPA） apparatus is designed.It has a small pixel of 25 μm×25 μm

high duty cycle of 90 %

steady mechanical support and high response ratio.The structural and thermal analysis of the UFPAs are simulated by using finite element analysis are compared with the microbolometers which the Raytheon company reported.The results prove that it has high both structural and thermal performance.And an 80 % above average infrared absorption between 8

14 μm

wavelenght is gained by classical optical films measures.