The fabrication and consistency of micro bump array devices are difficult problems in the field of micro-machining. The shape evolution of the bump arrays with different array space and current density is simulated by the finite-element method based on electrochemical reaction kinetics which takes the flow field distribution and mass transport of reactive ions into consideration. The results shows that the small current density is beneficial to the formation of a good consistency of the bump arrays with different filling ratios. Electroforming experiment on micro-hole with diameter 30 μm

depth 50 μm

array space 150

180

210 μm is carried out aiming at electric current density of 1A/dm2 to obtain the shape evolution at different time. The experimental results and simulation results show good consistency based on the point of view of shape evolution. At the same time

the diameter error of the spherical bump arrays is within 5 μm

showing good consistency. A novel method for the fabrication of microlens arrays has been developed

utilizing the spherical structures gained by electroforming

combined with soft replica molding.