GUO Yu-gang, RAO Hao, TAO Mao-jun, et al. MEMS SOI high temperature pressure sensor chip[J]. 2018, 37(11): 92-95. DOI: 10.13873/j.1000-9787(2018)11-0092-04.
A silicon on insulator(SOI) high temperature piezoresistive pressure sensor chip is researched and fabricated based on micro-electro-mechanical system(MEMS) technology. The pressure sensitive resistors are isolated by Si O2 from the silicon substrate to solve current leakage problem of the traditional PN junction isolated type in high temperature.The pressure range of the developed high temperature pressure sensor chip is 0
2 MPa
the full scale output is more than 100 m V with 1 m A at room temperature
the non-linearity is less than 0.15 %FS
the pressure hysteresis is less than 0. 05 % FS. In the operating temperature range from-55 ℃ to 150 ℃
the temperature coefficient of zero-point is less than 20 μV/℃
the temperature coeffi
cient of sensitivity is less than0.02 %FS/℃
the zero-point temperature hysteresis is less than 0. 1 % FS. The short time zero-point drift test is carried out to verify its stability
the result is prior to 0.05 %FS in 150 ℃ condition.