In wafer-level vacuum packaging of micro-electro-mechanical system（ MEMS）

in order to provide guidance for parameters of glass-reflow when making though glass via（ TGV） substrate

a general model should be proposed established for glass-reflow in micro-channel to study the influence of channel depth

channel width

flow time

flow temperature on glass-reflow

and deduce how flow depth change with flow time when channel depth

channel width

flow time is sure. A math model of glass reflow is established

theoretical equation of flow depth of glass reflow with time is induced through a series of theoretical analysis

derivation simplified operations

with the knowledge of hydromechanics and feature of micro-channel flow. Then a glass reflow experiment is conducted and flow depth is recorded with the channel depth L of 1 000 m

channel width 2b of 200 m and flow temperature T0of800 ℃; theoretical curve of glass reflow is compared with the experimental data. Experimental results indicate that experimental data is coincided with theoretically curve of glass reflow. Glass flows in micro-channel of glass-reflow technology by the knowledge of hydromechanics is studied firstly

and theoretically equation of flow depth of glass reflow with time in condition of unsteady flow field is induced

which has some challenges and innovation. These results demonstrate validity of theoretical model of glass reflow and its analysis process. The theoretical analysis model can provide some guidance for technical parameters of TGV glass reflow.