CHENG Xin, WU Ya-lin, CHEN Dong-liang, et al. Research status and development trend of high temperature sensor ASIC[J]. 2017, 36(9): 5-7+16. DOI: 10.13873/j.1000-9787(2017)09-0005-03.
高温传感器专用集成电路研究现状与发展趋势
摘要
简要概述了集成电路高温性能下降、甚至无法工作的原因。阐述了高温专用集成电路研究的必要性
介绍了国内外的研究现状。给出了国外高温传感器专用集成电路实现的主要技术和设计技巧
分析了专用集成电路的发展趋势。总结了实际高温应用环境中芯片失效的原因
并结合工艺兼容问题
提出了一些合理建议。
Abstract
High temperature sensor application specific integrated circuit( ASIC) has wide application prospects in some special fields of energy
aerospace
and heavy industry. The reason which causes circuit performance degradation and out of work is given in outline. The necessity of high temperature sensor ASIC is elaborated. The domestic and international research status is introduced. Major technologies and design tactics are given. The trend of development is analyzed. The reasons which cause chip failure in high temperature application are summed
and some sane proposals are put forward combined with process compatible.