1. 桂林理工大学机械与控制工程学院
2. 大连交通大学软件学院
3. 江西应用科技学院人工智能学院
纸质出版:2024
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张鑫, 张烈平, 唐滔, 等. 多层可延展柔性电路互连结构优化[J]. 传感器与微系统, 2024,(2):17-20+24.
张鑫, 张烈平, 唐滔, 等. 多层可延展柔性电路互连结构优化[J]. 传感器与微系统, 2024,(2):17-20+24. DOI: 10.13873/J.1000-9787(2024)02-0017-04.
为了提高柔性电子产品的穿戴舒适性,克服对皮肤产生的约束,提出基于非参数回归响应面代理模型和多目标遗传算法,对垂直互连通孔及导线焊盘大小与皮肤界面应力之间的模型进行预测并优化。以两层可延展柔性电路中垂直互连通孔及导线焊盘尺寸为研究对象,运用最佳填充空间设计抽样方法,建立试验样本点,通过非参数回归方法,拟合试验样本点,并利用验证点提高了响应面精度。采用多遗传算法在响应面模型内进行全局寻优,得出了一组满足皮肤舒适性的最优参数组合,对该最优参数组合进行仿真验证,验证结果表明了该方法的有效性,实现了多层可延展柔性电路互连结构的优化。
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Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Biomedical Engineering, School of Precision Instrument and Opto-electronics Engineering, Tianjin University, Tianjin, China,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China,Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Biomedical Engineering, School of Precision Instrument and Opto-electronics Engineering, Tianjin University, Tianjin, China,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,The Key Laboratory of Materials Processing and Mold of Ministry of Education, School of Materials Science and Engineering, School of Physics & Engineering, Zhengzhou University, Zhengzhou, China,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Soft Matter Materials Branch, Materials and Manufacturing Directorate, The Air Force Research Laboratory, Wright-Patterson Air Force Base, OH, USA,Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, CA, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Soft Matter Materials Branch, Materials and Manufacturing Directorate, The Air Force Research Laboratory, Wright-Patterson Air Force Base, OH, USA,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA,Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, CA, USA,State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China,Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA,Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA,Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, CA, USA,Department of Bioengineering, University of California San Diego, La Jolla, CA, USA.Three-dimensional integrated stretchable electronics[J].Nature Electronics,2018.
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