中北大学仪器科学与动态测试教育部重点实验室
纸质出版:2022
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钱江, 秦丽, 贾平岗, 等. 硅MEMS光纤法珀振动传感器的温度解耦分析[J]. 传感器与微系统, 2022,(6):29-32+36.
硅MEMS光纤法珀振动传感器的温度解耦分析[J]. 2022, (6): 29-32+36.
钱江, 秦丽, 贾平岗, 等. 硅MEMS光纤法珀振动传感器的温度解耦分析[J]. 传感器与微系统, 2022,(6):29-32+36. DOI: 10.13873/J.1000-9787(2022)06-0029-04.
硅MEMS光纤法珀振动传感器的温度解耦分析[J]. 2022, (6): 29-32+36. DOI: 10.13873/J.1000-9787(2022)06-0029-04.
提出了一种应用于400℃环境下的硅微机电系统(MEMS)光纤法珀(F-P)高温振动传感器,并对该传感器进行了温度解耦分析和实验验证。通过MATLAB软件对传感器的法珀干涉光谱进行计算分析,利用MEMS技术设计并加工了传感器及温度集成单元,根据该温度集成单元设计了温度解耦算法。实验结果表明:传感器能在2~22 g
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20~400℃环境下工作,设计的温度解耦方法将振动测量误差降低到1.316 7%。传感器及其温度解耦分析为高温振动测量领域提供了技术参考。
提出了一种应用于400℃环境下的硅微机电系统(MEMS)光纤法珀(F-P)高温振动传感器,并对该传感器进行了温度解耦分析和实验验证。通过MATLAB软件对传感器的法珀干涉光谱进行计算分析,利用MEMS技术设计并加工了传感器及温度集成单元,根据该温度集成单元设计了温度解耦算法。实验结果表明:传感器能在2~22 g
n
20~400℃环境下工作,设计的温度解耦方法将振动测量误差降低到1.316 7%。传感器及其温度解耦分析为高温振动测量领域提供了技术参考。
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硅基MEMS光强型光纤加速度计的设计与制作 [D]. 玄伟. 吉林大学 2007
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