High temperature packaging micro-electro-mechanical system（MEMS） pressure-sensitive component is basic core device for fabrication of high frequency response and high temperature MEMS pressure transducer

conductive sintering and insulation sintering technology is the key technology of high temperature packaging MEMS pressure-sensitive component.The feasibility of nano-silver glass slurry used in conducting sintering between Cr/Pt/Au multilayer metal electrodes and high-temperature tube base kovar alloy（4J29） conversion terminals is verified by comparative experiment.Through simulation calculation and experimental verification

component which use nano-silver glass plasma sintering can toletate 5 cycle temperature shock assessment range of-55 ～ 350 ℃

the high frequency response and high-temperature MEMS pressure sensor have a good performance of output stability under high temperature and normal temperature and low temperature

which meets various of application requirement of high frequency and high temperature such as aerospace

industrial

civil.