In order to realize thermal control of high-power focal plane component

analyze on characteristic of thermal design of focal plane component

single phase fluid loop thermal control system is adopted for heat dissipation. Taking a high-power splicing CCD as example

detail thermal design scheme is given and calculation result of the simplified analysis model for heat dissipation shows that the highest temperature of focal plane component is 26. 5 ℃. Transient-state simulation analysis of loop temperature control system is carried out through NX advanced simulation module

and the result shows that the temperature of CCD component maintains about27 ℃ after 200 s. Simulation analysis result is well coincide with theoretical calculation result

which can meet demand for thermal control index.