LIAO Qing-yuan, YE Bo-long. Design of vibration monitoring system for wafer transmission based on wireless MEMS sensor[J]. 2015, 34(4): 102-104. DOI: 10.13873/J.1000-9787(2015)04-0102-03.
A vibration monitoring system of wafer transmission is designed. Taking the MEMS capacitive acceleration sensor as test vector to collect vibration data
and the Bluetooth wireless sensor networks( WSNs) is used to transmit the signal data to host computer
on monitoring computer
data processing and real-time display can be completed. The MEMS sensor can meet the light load test requirement of wafer transmission process
and using of the Bluetooth mode can avoid drawbacks of complex wiring
high cost in vibration monitoring system. With the help of the vibration system
online real-time supervision of wafer transmission in semiconductor factory can be realized