A novel vacuum packaging method is proposed for vacuum packaging optically readable infrared imaging focal plane array（ ORIRFPA） device. The vacuum packaging structure is made up of three parts

a visible light window

a silicon spacer

and an infrared window. The silicon spacer is bonded to visible light window-glass using anodic bonding to form packaging cavity

for chip placement; infrared window is not only used to selectively transmit infrared radiation ranges from 8 μm to 14 μm

but also is used as packaging cover board; packaging cavity is solder bonded to infrared window in vacuum chamber. Then the packaging structure passes air tightness test

and thermal images of soldering iron at temperature 200 ℃ are test and obtained.